TY - JOUR AU - Donaldson, P. E. K. PY - 1980 DA - 1900/01/01 TI - Helium Leak Measurements as a Predictor of Hermetic Package Life in Surgically-implanted Microelectronic Devices SP - 385924 VL - 6 AB - SN - 0882-7516 UR - https://doi.org/10.1155/APEC.6.263 DO - 10.1155/APEC.6.263 JF - ElectroComponent Science and Technology PB - Hindawi Publishing Corporation KW - ER -